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Conference Proceedings

1. Ge Interface Passivation Techniques and Their Thermal Stability

D. Kuzum ; T. Krishnamohan ; A. Pethe ; Y. Oshima ; Y. Sun

Pub. info.:	SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices. pp.1025-1029, 2008. Pennington, NJ. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	16(10)

Conference Proceedings

2. Germanium for High Performance MOSFETs and Optical Interconnects

K. Saraswat ; D. Kim ; T. Krishnamohan ; D. Kuzum ; A.K. Okyay

Pub. info.:	SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices. pp.3-12, 2008. Pennington, NJ. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	16(10)

Conference Proceedings

3. Low Temperature Boron Activation in Amorphous Germanium for Three Dimensional Integrated Circuits (3D-ICs) using Ni-induced Crystallization

J. Park ; M. Tada ; H. Yu ; D. Kuzum ; Y. Na

Pub. info.:	SiGe, Ge, and Related Compounds 3: Materials, Processing, and Devices. pp.909-916, 2008. Pennington, NJ. Electrochemical Society
Title of ser.:	ECS transactions
Ser. no.:	16(10)