1.

Conference Proceedings
Conference Proceedings
1. Diffusional Void Growth in Dual-Inlaid Cu Interconnects
Jawarani, D. ; Gall, M. ; Capasso, C. ; Clark, G. ; Hernandez, R. ; Kawasaki, H.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.198-205,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
2.

Technical Paper
Technical Paper
2. CARBON FIBRE COMPOSITE COUPONS: STATIC AND FATIGUE BEHAVIOUR AFTER IMPACT DAMAGE
Clark, G.
Pub. info.: NASA Technical Reports.  (ARL-STRUC-R-422),  pp.1-30,  1986.  National Aeronautics and Space Administration