1.

Conference Proceedings
Conference Proceedings
1. *NANOSTRUCTURE FABRICATION: DRY ETCHING DAMAGE
Doughty, G. F. ; Cheung, R. ; Foad, M. A. ; Rahman, M. ; Cameron, N. I. ; Johnson, N. P. ; Wang, P. D. ; Wilkinson, C. D. W.
Pub. info.: Photons and low energy particles in surface processing : symposium held Decmber[i.e. December] 3-6, 1991, Boston, Massachusetts, U.S.A..  pp.223-234,  1992.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 236
2.

Conference Proceedings
Conference Proceedings
2. Characterization of Electrodissolving Copper in Aqueous Acid Solution for Sub-Quarter Micron Interconnect Formation in Low-k Materials
Lopatin, S. ; Preusse, A. ; Cheung, R.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.221-231,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
3.

Conference Proceedings
Conference Proceedings
3. The Electrical Integrity of Copper Plated Wafers Using a Novel Plating Bath Chemistry : Feasibility of RTA for Film Stabilization
Simpson, C.R. ; Baker, B.C. ; Herrick, M. ; Basser, P. ; Hamilton, G. ; Weitzman, E. ; Hey, P. ; Subramanyan, S. ; Chen, M. ; Shin, H. Seon ; Dordi, Y. ; Cheung, R. ; Carl, D.
Pub. info.: Interconnect and contact metallization for ULSI : proceedings of the international symposium.  pp.130-138,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-31
4.

Conference Proceedings
Conference Proceedings
4. 29. Fundamental Shift in ULSI Interconnect Technology - Electrochemical Deposition of Cu for on Chip Interconnects
Ting, C.H. ; Dubin, V. ; Cheung, R.
Pub. info.: Proceedings of the Symposium on Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling.  pp.321-335,  1997.  Pennington, New Jersey.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-27
5.

Conference Proceedings
Conference Proceedings
5. Copper Electroplating for On-Chip Metallization
Dubin, V. ; Lopatin, S. ; Cheung, R.
Pub. info.: Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability.  pp.12-22,  1998.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-6
6.

Conference Proceedings
Conference Proceedings
6. Copper Electroplating for Damascene ULSI Interconnects
Dubin, V. M. ; Lopatin, S. ; Chen, S. ; Cheung, R. ; Ryu, C. ; Wong, S. S.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.275-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514
7.

Conference Proceedings
Conference Proceedings
7. EFFECTS OF CONFINEMENT ON PLASTIC DEFORMATION IN PASSIVATED Al FILMS
Anderson, S. G. H. ; Yeo, I. -S. ; Ho, P. S. ; Ramaswami, S. ; Cheung, R.
Pub. info.: Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A..  pp.261-,  1993.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 309
8.

Conference Proceedings
Conference Proceedings
8. Profile Modeling of Collimated Ti Physical Vapor Deposition
Bang, D. ; McVittie, J.P. ; IslamRaja, M.M. ; Saraswat, K. C. ; Krivokapic, Z. ; Ramaswami, S. ; Cheung, R.
Pub. info.: Proceedings of the tenth symposium on plasma processing.  pp.557-567,  1994.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 1994-20
9.

Conference Proceedings
Conference Proceedings
9. EFFECTS OF CONFINEMENT ON PLASTIC DEFORMATION IN PASSIVATED Al FILMS
Anderson, S. G. H. ; Yeo, I. -S. ; Ho, P. S. ; Ramaswami, S. ; Cheung, R.
Pub. info.: Thin films : stresses and mechanical properties IV : symposium held April 12-16, 1993, San Francisco, California, U.S.A..  pp.329-,  1993.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 308
10.

Conference Proceedings
Conference Proceedings
10. The Effect of Plasma Etching on the Electrical Characteristics of 4H-SiC Schottky Diodes
Plank, N.O.V. ; Jiang, L. ; Gundlach, A.M. ; Cheung, R.
Pub. info.: Silicon carbide and related materials 2002 : ECSCRM2002, proceedings of the 4th European Conference on Silicon Carbide and Related Materials, September 2-5, 2002, Linköping, Sweden.  pp.689-692,  2003.  Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 433-436