1.

Conference Proceedings
Conference Proceedings
1. Effect of Current Direction on the Reliability of Different Capped Cu Interconnects
Gan, C.L. ; Lee, C.Y. ; Cheng, C.K. ; Gambino, J.
Pub. info.: Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.289-294,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 863
2.

Conference Proceedings
Conference Proceedings
2. Effects Of Focused Ion Beam On ECP Copper
Zhao, S.P. ; Koh, L.T. ; Zhang, D.H. ; Loh, S.A. ; Liew, G.M. ; Li, C.Y. ; Woo, Y.K. ; Cheng, C.K. ; Foo, P.D.
Pub. info.: Semiconductor technology (ISTC 2001) : proceedings of the 1st International Conference on Semiconductor Technology.  pp.123-130,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-17
3.

Conference Proceedings
Conference Proceedings
3. Component analyses of mixed spices
Cheng, C.K. ; Chen, C.C. ; Shu, W.Y. ; Shih, L.L. ; Feng, H.H.
Pub. info.: Spices : flavor chemistry and antioxidant properties.  pp.160-174,  1997.  Washington, DC.  American Chemical Society
Title of ser.: ACS symposium series
Ser. no.: 660