1.

Conference Proceedings
Conference Proceedings
1. Thermal Characterization of Flip-Chip BGA
Chen,H.N. ; Wu,C.T. ; Lin,P.J. ; Hung,S.C.
Pub. info.: Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts.  pp.357-361,  2000.  Reston, VA.  IMAPS
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4339
2.

Conference Proceedings
Conference Proceedings
2. Board Level Reliability of Chip Scale Packages
Hung,Sung-Ching ; Zheng,P.J. ; Chen,H.N. ; Lee,S.C. ; Lee,J.J.
Pub. info.: Proceedings : 1999 International Symposium on Microelectronics : 26-28 October 1999, Chicago, Illinois.  pp.571-580,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3906
3.

Conference Proceedings
Conference Proceedings
3. Plastic-molded package of AlGalnP laser apparatus
Chen,H.N. ; Hwang,R.Y. ; Hsu,J.T. ; Lee,B.J.
Pub. info.: Fabrication, testing, and reliability of semiconductor lasers : 31 January-1 February, 1996, San Jose, California.  pp.42-49,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2683