1.

Conference Proceedings
Conference Proceedings
1. Packaging issues using FEA and experimental verification on a Si-based capacitive microrelay
Premachandran,C.S. ; Zhang,X. ; Chai,T.C. ; Samper,V. ; Lim,T.B.
Pub. info.: Reliability, testing, and characterization of MEMS/MOEMS : 22-24 October 2001, San Trancisco, USA.  pp.226-233,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4558
2.

Conference Proceedings
Conference Proceedings
2. Development and application of micro-moire interferometer
Oh,K.E. ; Chai,G.B. ; Asundi,A.K. ; Chan,K.C. ; Chai,T.C.
Pub. info.: Advanced photonic sensors and applications : 30 November-3 December 1999, Singapore.  pp.650-657,  1999.  Bellingham, Wash., USA.  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3897
3.

Conference Proceedings
Conference Proceedings
3. Si-based microphone testing methodology and noise reduction
Premachandran,C.S. ; Wang,Z. ; Chai,T.C. ; Chong,S.C. ; Iyer,M.K.
Pub. info.: Design, Test, Integration, and Packaging of MEMS/MOEMS : 9-11 May 2000, Paris, France.  pp.588-592,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4019