Search records | 東京工業大学附属図書館文献データベース

You can search for articles included in proceedings of international conferences and technical papers which Tokyo Tech Library holds.
Tokyo Tech members can obtain tables of contents of 17,000 foreign journals by SwetScan. Tokyo Tech Library does not cover all of them.
List of Searchable Databases

Clear Form

Search for other sites by same keyword(s).

CiNii Books

NDL Search

WebcatPlus

amazon

カーリル

WorldCat

Filter

Title:

Author:

ISBN / ISSN / Paper No:

Source Title:

Publisher:

Publication Year:

～

Clear Form

Type:

Conference Proceedings

Technical Paper

Academic Journal

Select: Check all | Remove all

Sort order

10 | 50 | 100 / Per Page

11 results

Conference Proceedings

1. ESTIMATING LOCAL DEPOSITION CONDITIONS AND KINETIC PARAMETERS USING FILM PROFILE

Cale, T. S. ; Chara, M. B. ; Hasper, A.

Pub. info.:	Advanced metallization and processing for semiconductor devices and circuits--II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.. pp.393-398, 1992. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	260

Conference Proceedings

2. The Roles of "3-D/2-D" and "3-D/3-D" Topography Simulators in Virtual Wafer Fabs

Cale, T. S. ; Merchant, T. P. ; Borucki, L. J.

Pub. info.:	Semiconductor process and device performance modeling : symposium held December 2-3, 1997, Boston, Massachusetts, U.S.A.. pp.201-, 1998. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	490

Conference Proceedings

3. The Effects of Temperature Ramping on MOCVD Al Film Properties

Yang, D. ; Jonnalagadda, R. ; Mahadev, V. ; Cale, T. S. ; Hillman, J. T. ; Foster, R. F.

Pub. info.:	Polycrystalline thin films : structure, texture, properties and applications III : symposium held March 31-April 3, 1997, San Francisco, California, U.S.A.. pp.337-, 1997. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	472

Conference Proceedings

4. Study of Factor and Interaction Effects During Programmed Rate Chemical Vapor Deposition of Aluminum

Yang, D. ; Jonnalagadda, R. ; Rogers, B. R. ; Hillman, J. T. ; Foster, R. F. ; Cale, T. S.

Pub. info.:	Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A.. pp.121-, 1998. Warrendale, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	514

Conference Proceedings

5. Modeling of ionized magnetron sputtering of copper

Bloomfield, M. O. ; Cale, T. S.

Pub. info.:	New methods, mechanisms and models of vapor deposition : symposium held April 24-26, 2000, San Francisco, California, U.S.A.. pp.147-, 2000. Warrendale, PA. MRS-Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	616

Conference Proceedings

6. IMPACTS OF TEMPERATURE AND REACTANT FLOW RATE TRANSIENTS ON LPCVD TUNGSTEN SILICIDE FILM PROPERTIES

Cale, T. S. ; Park, J. -H. ; Raupp, G. B. ; Jain, M. K.

Pub. info.:	Rapid thermal and integrated processing : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.. pp.171-176, 1991. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	224

Conference Proceedings

7. Wafer Thinning for Monolithic 3D Integration

Jindal, A. ; Lu, J. -Q. ; Kwon, Y. ; Rajagopalan, G. ; McMahon, J. J. ; Zeng, A. Y. ; Flesher, H. K. ; Cale, T. S. ; Gutmann, R. J.

Pub. info.:	Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.. pp.21-26, 2003. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	766

Conference Proceedings

8. Dielectric Glue Wafer Bonding for 3D ICs

Kwon, Y. ; Jindal, A. ; McMahon, J. J. ; Lu, J. -Q. ; Gutmann, R. J. ; Cale, T. S.

Pub. info.:	Materials, Technology and Reliability for Advanced Interconnects and Low-k Dielectrics-2003 : symposium held April 21-25, 2003, San Francisco, California, U.S.A.. pp.27-32, 2003. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	766

Conference Proceedings

9. Multiscale Mechanical Modeling of CMP

Seok, J. ; Sukam, C. P. ; Kim, A. T. ; Tichy, J. A. ; Cale, T. S.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.210-224, 2002. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2002-1

10.

Conference Proceedings

10. MODELING OF COLLIMATED TITANIUM NITRIDE PHYSICAL VAPOR DEPOSITION USING A COMBINED SPECULAR-DIFFUSE FORMULATION

Toprac, A. J. ; Jones, B. P. ; Schlueter, J. ; Cale, T. S.

Pub. info.:	Evolution of thin film and surface structure and morphology : symposium held November 28-December 2, 1994, Boston, Massachusetts, USA. pp.575-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	355

11 results

Select: Check all | Remove all

Sort order

10 | 50 | 100 / Per Page

Filtering by:

Author: Cale, T. S.