1.

Conference Proceedings
Conference Proceedings
1. Microstructural Characteristics of Cu-Fe-P Alloys Severely Deformed by Accumulative Roll Bonding Process
C.Y. Lim ; S.Z. Han ; S.H. Lee
Pub. info.: THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canada.  539-543  pp.2849-2852,  2007.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 539-543(3)
2.

Conference Proceedings
Conference Proceedings
2. Effect of Strain Rate on Microstructural Evolution of Nano-Grained Copper in Accumulative Roll-Bonding Process
S.H. Lee ; S.S. Kim ; S.Z. Han ; C.Y. Lim
Pub. info.: Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea.  pp.71-74,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 580-582
3.

Conference Proceedings
Conference Proceedings
3. Deformation Behavior of Functionally Graded Ti-Ni Shape Memory Alloys
T.H. Nam ; H.G. Kim ; J.Y. Choi ; J.M. Lee ; S.B. Kang ; C.Y. Lim
Pub. info.: Eco-materials processing and design VIII : ISEPD-8, proceedings of the 8th International Symposium on Eco-Materials Processing and Design, January 11-13, 2007, Kitakyushu, Japan.  pp.211-214,  2007.  Stafa-Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 544-545