1.

Conference Proceedings
Conference Proceedings
1. Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements
C.M. Lin ; C.Y. Chu ; W.L. Chang
Pub. info.: Advanced manufacture : focusing on new and emerging technologies : selected peer reviewed papers from the 2007 International Conference on Advanced Manufacture, Tainan, Taiwan, R.O.C., November 26-November 28, 2007.  pp.163-168,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 594
2.

Conference Proceedings
Conference Proceedings
2. Fabrication of Nano-MgO Reinforced Fe-Cr-Ni Composites by Reactive Hot Pressing
C. Chen ; J.F. Yang ; J.Q. Gao ; C.Y. Chu
Pub. info.: Eco-materials processing and design X : selected peer reviewed papers from the 10th International Symposium on Eco-Materials Processing and Design, ISEPD, Xian, China, January 13-15, 2009.  pp.551-554,  2009.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 620-622
3.

Conference Proceedings
Conference Proceedings
3. Investigating the Deformation, Breakage and Number on Conductive Particle of Flim-on- Glass Packaging Using Anisotropic Conductive Film Bonding
C.M. Lin ; Y.C. Chiou ; C.Y. Chu
Pub. info.: Nano Engineering and Materials Technologies.  pp.97-101,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 886