1.

Conference Proceedings
Conference Proceedings
1. Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements
C.M. Lin ; C.Y. Chu ; W.L. Chang
Pub. info.: Advanced manufacture : focusing on new and emerging technologies : selected peer reviewed papers from the 2007 International Conference on Advanced Manufacture, Tainan, Taiwan, R.O.C., November 26-November 28, 2007.  pp.163-168,  2008.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 594
2.

Conference Proceedings
Conference Proceedings
2. Microstructure and Wear Characteristics of Fe-Based Hard-Facing Alloy Claddings Formed by Gas Tungsten Arc Welding
C.M. Lin ; W. Wu
Pub. info.: THERMEC 2011 : International Conference on Processing & Manufacturing of Advanced Materials : processing, fabrication, properties, applications, August 1-5, 2011, Quebec City, Canada.  pp.3028-3033,  2012.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 706-709
3.

Conference Proceedings
Conference Proceedings
3. Investigating the Deformation, Breakage and Number on Conductive Particle of Flim-on- Glass Packaging Using Anisotropic Conductive Film Bonding
C.M. Lin ; Y.C. Chiou ; C.Y. Chu
Pub. info.: Nano Engineering and Materials Technologies.  pp.97-101,  2017.  Aedermannsdorf, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 886