1.

Conference Proceedings
Conference Proceedings
1. Evaluation of Commercialized Slurries and Pads for Polymer CMP (Chemical Mechanical Polishing)
Zhang, F. ; Wake, R.W. ; Cook, L. ; Busnaina, A.A.
Pub. info.: Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing.  pp.246-254,  1998.  Pennington, N. J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-7
2.

Conference Proceedings
Conference Proceedings
2. Nano-particle laser removal from silicon wafers
Lee, J.M. ; Cho, S.H. ; Kim, T.H. ; Park, J.-G. ; Busnaina, A.A.
Pub. info.: Fourth International Symposium on Laser Precision Microfabrication : 21-24 June, 2003, Munich, Germany.  pp.441-444,  2003.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5063
3.

Conference Proceedings
Conference Proceedings
3. Single Wafer Non-Contact Post-CMP Cleaning Using DI Water and Dilute Chemistry
Busnaina, A.A. ; Moumen, N ; Piboontum, J.
Pub. info.: Chemical mechanical planariarization in IC device manufacturing III : proceedings of the international symposium.  pp.468-476,  1999.  Pennington, N. J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-37
4.

Conference Proceedings
Conference Proceedings
4. ADHESION AND REMOVAL OF SILICA AND ALUMINA SLURRY PARTICLES DURING Cu CMP PROCESS
Park, J. ; Busnaina, A.A.
Pub. info.: Cleaning technology in semiconductor device manufacturing VIII : proceedings of the international symposium.  pp.312-320,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-26
5.

Conference Proceedings
Conference Proceedings
5. Effect of Additives in Post Cu CMP Cleaning Solutions on Particle Adhesion and Removal
Hong, Y.K. ; Eom, D.H. ; Lee, S.H. ; Park, J.G. ; Busnaina, A.A.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.19-26,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-21
6.

Conference Proceedings
Conference Proceedings
6. Effects of Pulsating Flow on Cleaning of and Deposition into Trenches
Suni, L.I. ; Lin, H. ; Busnaina, A.A.
Pub. info.: Fundamental gas-phase and surface chemistry of vapor-phase deposition II and process control, diagnostics, and modeling in semiconductor manufacturing IV : proceedings of the international symposium.  pp.332-339,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-13
7.

Conference Proceedings
Conference Proceedings
7. Copper Electroplating onto Silicon Wafers Using High Frequency Acoustic Streaming
Suni, I.I. ; Tiwari, C. ; Busnaina, A.A. ; Lin, H. ; Reynolds., H.V. ; Neely, C.
Pub. info.: Copper Interconnects, New Contact Metallurgies/Structures, and Low-K Interlevel Dielectrics : proceedings of the International Symposium.  pp.15-22,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-27
8.

Technical Paper
Technical Paper
8. Particle Adhesion and Removal in the Semiconductor Industry.
Busnaina, A.A. ; Xiong, X. ; Park, J.G.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : TRIB
Ser. no.: 2003