1.

Conference Proceedings
Conference Proceedings
1. Device and process integration for a 0.55-ｦﾌm channel length CMOS device
Waldo,W.G. ; Turkman,I. ; Brownson,R.
Pub. info.: Microelectronic Device and Multilevel Interconnection Technology II.  pp.124-135,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2875
2.

Conference Proceedings
Conference Proceedings
2. Shadowing of lightly doped drain implants due to gate etch profiles and implanter configurations
Henis,N.B. ; Abercrombie,D. ; Brownson,R.
Pub. info.: Microelectronic Device and Multilevel Interconnection Technology II.  pp.169-177,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2875
3.

Conference Proceedings
Conference Proceedings
3. Role of RIE in microchip bond pad corrosion
Brownson,R. ; Butler,K. ; Cadena,S. ; Detar,M. ; Johnson,I. ; McCoulloch,L. ; McCoulloch,J. ; Mishra,B. ; Healey,J.T. ; Honcik,K. ; Phan,T.T. ; Sterif,T. ; Stevens,H. ; Tovar,A.
Pub. info.: Microelectronic Manufacturing Yield, Reliability, and Failure Analysis II.  pp.95-102,  1996.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 2874