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Conference Proceedings

1. Thermal Modeling and Mechanical Analysis of Very Thin Silicon Chips for Conformal Electronic Systems

Young,Jedediah ; Malshe,Ajay P. ; Brown,W.D. ; Lenihan,Timothy ; Albert,Douglas ; Ozguz,Volkan

Pub. info.:	Proceedings : 2001 HD International Conference on High-Density Interconnect and Systems Packaging : April 17-20, 2001, Santa Clara Convention Center, Santa Clara, California. pp.14-21, 2001. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4428

Conference Proceedings

2. Effects of Packaging Process Steps on the Functionality of MEMS Devices: Investigation of Electrical Interconnection on Lubricated MEMS

Malshe,Ajay P. ; Shingh,Sushila ; Hankins,Keith ; Young,Jedediah J. ; Park,B.S. ; Yedave,S.N. ; Brown,W.D.

Pub. info.:	Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts. pp.580-585, 2000. Reston, VA. IMAPS
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4339

Conference Proceedings

3. Modelling of Aluminum Enhanced Crystallization in Hydrogenated Amorphous Silicon(a-Si:H)

Khalifa,F.A. ; Anser,M.N. ; Naseem,H.A. ; Shultz,J.L. ; Brown,W.D.

Pub. info.:	Proceedings of the Tenth International Workshop on the Physics of Semiconductor Devices (December 14-18, 1999). Part1 pp.303-310, 2000. Bellingham, Wash.. SPIE - The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	3975

Conference Proceedings

4. 3-LAYERED 3D FLEX BASED MCM:ELECTRICAL CHARAC-TERIZATION AND RELIABILITY ISSUES

Malshe,Ajay P. ; Morrison,W.B. ; Railkar,T.A. ; Brown,W.D. ; Lenihan,T.G.

Pub. info.:	1999 International Conference on High Density Packaging and MCMs : 6-9 April 1999, The Adam's Mark Hotel, Denver, Colorado. pp.1-6, 1999. Reston, VA. IMAPS
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	3830

Conference Proceedings

5. MODELING AND ELECTRICAL ANALYSIS OF SEAMLESS HIGH OFF-CHIP CONNECTIVITY(SHOCC)INTERCONNECTS

Schaper,Leonard ; Alfonso,S. ; Parkerson,J.P ; Brown,W.D. ; Ang,S.S. ; Naseem,H.A.

Pub. info.:	1999 International Conference on High Density Packaging and MCMs : 6-9 April 1999, The Adam's Mark Hotel, Denver, Colorado. pp.327-331, 1999. Reston, VA. IMAPS
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	3830

Conference Proceedings

6. "Two-Layer, Planar, Superconducting Multichip Module Technology"

Brown,W.D. ; Ang,S.S. ; Chan,F.T. ; Luo,W.A. ; Salamo,G.J. ; Yao,H.J. ; Zhang,G. ; Cooksey,J.W.

Pub. info.:	2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA. pp.226-231, 2000. Reston, VA, Bellingham, Wash.. IMAPS — SPIE-The International Society for Optical
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4217

Conference Proceedings

7. Packaging and integration of MEMS and related microsystems for system-on-a-package (SOP)

Malshe,A.P. ; O'Neal,C.B. ; Singh,S. ; Brown,W.D.

Pub. info.:	Smart structures and devices : 13-15 December 2000, Melbourne, Australia. pp.198-208, 2000. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4235

Conference Proceedings

8. Investigation of Wirebonds on Insulated-Metal Substrate for Multichip Power Module Applications

Ng,W.L. ; Ang,S.S. ; Thach,T. ; Ivy,B. ; Barlow,F. ; Elshabini,A. ; Burgcrs,K.C. ; Olejniczak,K.J. ; Brown,W.D.

Pub. info.:	Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts. pp.99-104, 2000. Reston, VA. IMAPS
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4339

Conference Proceedings

9. A Micromachined Ball Grid Array Test Socket for Fine-Pitch Interconnect

Huang,B. ; Ang,S.S. ; Porter,E.V. ; Barlow,F. ; Qiao,Q. ; Gordon,M.H. ; Schmidt,W.F. ; Brown,W.D. ; Elshabini,A.

Pub. info.:	Proceedings : 2000 International Symposium on Microelectronics, September 20-22, 2000, Hynes Convention Center, Boston, Massachusetts. pp.172-177, 2000. Reston, VA. IMAPS
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	4339

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Conference Proceedings

10. Low-cost flexible ball-grid-array multichip module technology

Ang,S.S. ; Arnn,D.A. ; Meyer,D.J. ; Schaper,L.W. ; Brown,W.D.

Pub. info.:	Microelectronic Packaging and Laser Processing. pp.13-21, 1997. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:	Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:	3184

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Author: Brown,W.D.