1.

Conference Proceedings
Conference Proceedings
1. Backside Imaging CCD using Bonded and Etched Back Silicon on Epoxy
Booth, D.E. ; Hunt, C.E. ; Brown, W.E. ; Stover, R.J.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.584-591,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Radiation events in astronomical CCD images
Smith, A.R. ; McDonald, R.J. ; Hurley, D.L. ; Holland, S.E. ; Groom, D.E. ; Brown, W.E. ; Gilmore, D.K. ; Stover, R.J. ; Wei, M.
Pub. info.: Sensors and camera systems for scientific, industrial, and digital photography applications III : 21-23 January, 2002, San Jose, [California], USA.  pp.172-183,  2002.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4669