1.

Technical Paper
Technical Paper
1. Microstructure and Reliability of Surface Micromachined Polysilicon Used for MEMS.
Buchheit, T. E. ; Bataille, C. C. ; Michael, J. R. ; Boyce, B. L.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003
2.

Conference Proceedings
Conference Proceedings
2. Experimental apparatus and software design for dynamic long-term reliability testing of a spring-mass MEMS device [6111-23]
Reu, P. L. ; Tanner, D. M. ; Epp, D. S. ; Parson, T. B. ; Boyce, B. L.
Pub. info.: Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V.  pp.61110J-,  2006.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 6111