1.

Conference Proceedings
Conference Proceedings
1. Dielectric Analysis of the Cure of Thermosetting Epoxy/Amine Systems
Bidstrup, S. A. ; Sheppar, N. F. Jr. ; Senturia, S. D.
Pub. info.: Plastics-pioneering the 21st century : conference proceedings.  pp.987-989,  1987.  Brookfield Center, CT.  Society of Plastics Engineers, Inc. (SPE)
Title of ser.: Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.: 33
2.

Technical Paper
Technical Paper
2. A MEMS Active Cooling Substrate for Microelectronics Thermal Management.
Wang, Y. ; Yuan, G. ; Yoon, Y-K. ; Allen, M. G. ; Bidstrup, S. A.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003