1.

Conference Proceedings
Conference Proceedings
1. A Survey of Defects in Strained Si Layers
Bedell, S.W. ; Chen, H. ; Sadana, D.K. ; Fogel, K. ; Domenicucci, A.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.39-44,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
2.

Conference Proceedings
Conference Proceedings
2. Atomic-Layer Cleaving for SOI Wafer Fabrication and a Path Towards Laminated Electronics
Current, M.I. ; Malik, I.J. ; Bedell, S.W. ; Kirk, H. ; Korolik, M. ; Kang, S. ; Henley, F.J.
Pub. info.: Silicon-on-Insulator Technology and Devices X : proceedings of the tenth International Symposium.  pp.75-78,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-3
3.

Conference Proceedings
Conference Proceedings
3. Characterization of ultra thin SOI and SSOI substrates: defect and strain analysis Invited
Bedell, S.W. ; Hovel, H. ; Domenicucci, A. ; Fogel, K. ; Reznicek, A. ; Sadana, D.K.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.345-356,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03