1.

Conference Proceedings
Conference Proceedings
1. Electrical Characterization of Bonded SOI with Hg-contact “Horseshoe” Probes and InGa-contact “H-FET” Structures
Kirk, H. ; Bedell, S. ; Current, M.
Pub. info.: Silicon-on-Insulator Technology and Devices X : proceedings of the tenth International Symposium.  pp.103-108,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-3
2.

Conference Proceedings
Conference Proceedings
2. Homogenization of the Bilayers of Cu-Al Alloy and Pure Copper to Produce Cu-0.3 at.% Al Alloy Films
Wang, Pei-I ; Murarka, S. P. ; Bedell, S. ; Lanford, W. A.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.281-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514
3.

Conference Proceedings
Conference Proceedings
3. Capacitance-Voltage, Current Voltage, and Thermal Stability of Copper Alloyed with Aluminum or Magnesium
Felipe, T. Suwwan de ; Murarka, S. P. ; Bedell, S. ; Lanford, W. A.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.263-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514
4.

Conference Proceedings
Conference Proceedings
4. Stress Generation in PECVD silicon Nitride Thin Films for Microelectronics Applications
Belyansky, M. ; Klymko, N. ; Madan, A. ; Mallikarjunan, A. ; Li, Y. ; Chakravarti, A. ; Deshpande, S. ; Domenicucci, A. ; Bedell, S. ; Adams, E. ; Coffin, J. ; Tai, L. ; Sun, S-P. ; Widodo, J. ; Lai, C-W.
Pub. info.: Materials, technology and reliability of advanced interconnects - 2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.97-102,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 863
5.

Conference Proceedings
Conference Proceedings
5. Stress Generation in PECVD Silicon Nitride Thin Films for Microelectronics Applications
Belyansky, M. ; Klymko, N. ; Madan, A. ; Mallikarjunan, A. ; Li, Y. ; Chakravarti, A. ; Deshpande, S. ; Domenicucci, A. ; Bedell, S. ; Adams, E. ; Coffin, J. ; Tai, L. ; Sun, S-P. ; Widodo, J. ; Lai, C-W.
Pub. info.: Thin films : stresses and mechanical properties XI : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A..  pp.325-332,  2005.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 875