1.

Conference Proceedings
Conference Proceedings
1. ETCHING AND SURFACE MODIFICATION OF POLYMERS IN CF4/O2 PLASMA DISCHARGES
Scott, P. M. ; Babu, S. V. ; Partch, R. E. ; Matienzo, L. J.
Pub. info.: Electronic packaging materials science III : symposium held November 30-December 4, 1987, Boston, Massachusetts, U.S.A..  pp.207-212,  1988.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 108
2.

Conference Proceedings
Conference Proceedings
2. Role of Film Hardness on the Polish Rates of Metal Thin Films
Babu, S. V. ; Hariharaputhiran, M. ; Her, Y. S. ; Li, Y. ; Ramarajan, S.
Pub. info.: Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.123-128,  2000.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 566
3.

Conference Proceedings
Conference Proceedings
3. Mechanism of Cu Removal During CMP in H2O2-Glycine Based Slurries
Babu, S. V. ; Hariharaputhiran, M. ; Li, Y. ; Ramarajan, S.
Pub. info.: Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.129-134,  2000.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 566
4.

Conference Proceedings
Conference Proceedings
4. The Influence of pH and Temperature on Polish Rates and Selectivity of Silicon Dioxide and Nitride Films
America, W. G. ; Babu, S. V. ; Srinivasan, R.
Pub. info.: Chemical mechanical polishing -- fundamentals and challenges : symposium held April 5-7, 1999, San Francisco, California, U.S.A..  pp.13-18,  2000.  Warrendale, PA.  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 566
5.

Conference Proceedings
Conference Proceedings
5. Electrochemical Studies of Copper Chemical Mechanical Polishing Mechanism: Effects of Oxidizer Concentration
Lu, J. ; Garland, J. E. ; Petite, C. M. ; Babu, S. V. ; Roy, D.
Pub. info.: Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A..  pp.257-262,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 767
6.

Conference Proceedings
Conference Proceedings
6. Comparison of Glycine and Citric Acid as Complexing Agents in Copper Chemical-Mechanical Polishing Slurries
Gorantla, Venkata ; Babu, S. V.
Pub. info.: Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A..  pp.279-284,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 767
7.

Conference Proceedings
Conference Proceedings
7. The Effects of Particle Adhesion in Chemical Mechanical Polishing
Lu, Zhenyu ; Babu, S. V. ; Matijevic, Egon
Pub. info.: Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A..  pp.167-172,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 767
8.

Conference Proceedings
Conference Proceedings
8. Study of Slurry Composition Transition in a Rotary Copper CMP Process
Hegde, Sharath ; Patri, Udaya B. ; Jindal, Anurag ; Babu, S. V.
Pub. info.: Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A..  pp.27-32,  2003.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 767