1.

Conference Proceedings
Conference Proceedings
1. Placement and Reflow of Solder Balls for FC, BGA, Wafer-Level-CSP, Optoelectronic Components and MEMS by using a new SolderJetting Method
Oppert, Thomas ; Titerle, L. ; Zakel,E. ; Azdasht, G. ; Teutsch, T.
Pub. info.: Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO.  pp.145-150,  2002.  Washington, DC.  IMAPS
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4931
2.

Conference Proceedings
Conference Proceedings
2. LAPLACE - A New Assembly Method using Laser Heating for Ultra Fine Pitch Devices
Teutsch, T. ; Blankenhorn, R. G. ; Azdasht, G. ; Penke, P. ; Zakel, E. ; Kim, J.-D. ; Kim, Y.-N. ; Lee, J.-W. ; Park, J.-H. ; Kim, H.-G. ; Kim, J.-O.
Pub. info.: Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA.  pp.949-955,  2003.  Reston, Va..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5288