1.

Conference Proceedings
Conference Proceedings
1. Thermal Stress Characteristics and Void Formation in Al(Cu) Interconnects
Ho, P.S. ; Yeo, I.-s. ; Jawarani, D. ; Anderson, S.G. ; Kawasaki, H.
Pub. info.: Proceedings of the Symposium on Reliability of Metals in Electronics.  pp.106-115,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-3
2.

Conference Proceedings
Conference Proceedings
2. PLEIADES: a subpicosecond Thomson x-ray source for ultrafast materials probing
Fittinghoff, D.N. ; Springer, P.T. ; Barty, C.P.J. ; Brown, W.J. ; Crane, J.K. ; Cross, R.R. ; Ditmire, T. ; Gibson, D.J. ; Hartemann, F.V. ; Sage, G.P.L. ; Rosenzweig, J.B. ; Slaughter, D. ; Streitz, F.H. ; Tremaine, A.M. ; Anderson, S.G. ; Kuba, J. ; Booth, R. ; Moriarty, J. ; McMahan, A. ; Cynn, H. ; Yoo, C.-S.
Pub. info.: Commercial and biomedical applications of ultrafast lasers III : 28-30 January 2003, San Jose, California, USA.  pp.101-111,  2003.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4978