1.

Conference Proceedings
Conference Proceedings
1. 3D System-on-a-Chip Using Dielectric Glue Bonding and Cu Damascene Inter-Wafer Interconnects
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K-W. ; Craft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraum, E. ; Cale, T.S. ; Gutmann, R.J.
Pub. info.: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium.  pp.381-389,  2003.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-13
2.

Conference Proceedings
Conference Proceedings
2. Design and development of application-specific microfluidic components for flow control
Xu, B. ; Castracane, J. ; Altemus, B. ; Keijmel, J. ; Heuzinkveld, M.
Pub. info.: Microfluidics, bioMEMS, and medical microsystems : 27-29 January 2003, San Jose, California, USA.  pp.256-263,  2003.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4982
3.

Conference Proceedings
Conference Proceedings
3. Wafer-Level 3D System-on-a-Chip using Dielectric Glue Wafer Bonding and Cu Damascene Inter-Wafer Interconnects
Lu, J.-Q. ; Jindal, A. ; Kwon, Y. ; McMahon, J.J. ; Lee, K.-W. ; Kraft, R.P. ; Altemus, B. ; Cheng, D. ; Eisenbraun, E. ; Cale, T.S. ; Gutmann, R.J
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.87-95,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
4.

Conference Proceedings
Conference Proceedings
4. Reliability study of wafer bonding for micro-electro-mechanical systems
Almasri, M. ; Altemus, B. ; Gracias, A. ; Clow, L. ; Tokranova, N. ; Castracane, J. ; Xu, B.
Pub. info.: Reliability, Testing, and Characterization of MEMS/MOEMS III.  pp.79-86,  2004.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5343
5.

Conference Proceedings
Conference Proceedings
5. Fabrication of cantilever probes with integrated piezoresistive read-out and built-in piezoelectric actuators
Olson, S. ; Altemus, B. ; Sankaran, B. ; Tokranova, N. ; Geer, R. ; Castracane, J. ; Xu, B.
Pub. info.: MEMS/MOEMS Components and Their Applications II.  pp.167-174,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5717
6.

Conference Proceedings
Conference Proceedings
6. Integrated cantilever fabrication and system development for ultrasonic and acoustic scanning probe microscopy
Olson, S. ; Sankaran, B. ; Altemus, B. ; Xu, B. ; Geer, R.
Pub. info.: Testing, Reliability, and Application of Micro- and Nano-Material Systems III.  pp.159-167,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5766