1.

Conference Proceedings
Conference Proceedings
1. VOID GROWTH AS A FUNCTION OF RESIDUAL STRESS LEVEL IN THIN, NARROW ALUMINUM LINES
Korkohen, M. A. ; Borgesen, P. ; Paszkiet, C. A. ; Lee, J. K. ; Li, Che-Yu
Pub. info.: Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A..  pp.413-418,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 226
2.

Conference Proceedings
Conference Proceedings
2. THE EFFECT OF LINE GEOMETRY ON VOID GROWTH IN THIN, NARROW ALUMINUM LINES
Borgesen, P. ; Lee, J. K. ; Korhonen, M. A. ; Li, C. -Y.
Pub. info.: Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A..  pp.149-154,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 225
3.

Conference Proceedings
Conference Proceedings
3. VOID GROWTH AS A FUNCTION OF RESIDUAL STRESS LEVEL IN THIN, NARROW ALUMINUM LINES
Korhonen, M. A. ; Borgesen, P. ; Paszkiet, C. A. ; Lee, J. K. ; Li, Che-Yu
Pub. info.: Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A..  pp.155-160,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 225
4.

Conference Proceedings
Conference Proceedings
4. THE EFFECT OF LINE GEOMETRY ON VOID GROWTH IN THIN, NARROW ALUMINUM LINES
Borgesen, P. ; Lee, J. K. ; Korkohen, M. A. ; Li, C. -Y.
Pub. info.: Mechanical behavior of materials and structures in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A..  pp.407-412,  1991.  Pittsburgh, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 226