1.

Conference Proceedings
Conference Proceedings
1. Cylindrical cavity used for frequency or phase-locking vircators
Yu,G. ; Wang,W. ; Liu,S.
Pub. info.: Intense microwave pulses V : 31 July-1 August 1997, San Diego, California.  pp.113-118,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3158
2.

Conference Proceedings
Conference Proceedings
2. Formation of magnetite and iron-rich carbonates by thermophilic iron-reducing bacteria
Zhang,C. ; Vali,H. ; Liu,S. ; Roh,Y. ; Cole,D. ; Kirschvink,J.L. ; Onstott,T.C. ; McKay,D.S. ; Phelps,T.J.
Pub. info.: Instruments, methods, and missions for the investigation of extraterrestrial microorganisms : 29 July-1 August 1997, San Diego, California.  pp.61-68,  1997.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3111
3.

Conference Proceedings
Conference Proceedings
3. Electroluminescence from doped ZnS nanocrystals/polymer composite systems
Yang,Y. ; Huang,J. ; Xue,S. ; Ma,Y. ; Liu,S. ; Shen,J.
Pub. info.: Organic light-emitting materials and devices : 30 July-1 August 1997, San Diego, California.  pp.363-372,  1997.  Bellingham, Wash., USA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3148
4.

Conference Proceedings
Conference Proceedings
4. Reliability study of microelectronic packaging assemblies by a multiaxial submicron fatigue tester(Invited Paper)
Liu,S. ; Lu,M. ; Qian,Z. ; Ren,W.
Pub. info.: Microelectronic Packaging and Laser Processing.  pp.32-39,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3184
5.

Conference Proceedings
Conference Proceedings
5. Processing mechanics for flip-chip assembly
Wang,J. ; Qian,Z. ; Liu,S.
Pub. info.: Microelectronic Packaging and Laser Processing.  pp.22-29,  1997.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3184