1.

Conference Proceedings
Conference Proceedings
1. Integrated IMP Ti and MOCVD TiN for 300-mm W barrier and Liner for sub-0.18-ｦﾌm IC processing
Tolia,A. ; Menezes,M. ; Li,J. ; Jackson,M. ; Pavate,V. ; Khurana,N. ; Mosely,R. ; Narasimhan,M.K. ; Chang,M. ; Chen,F.E.
Pub. info.: Multilevel Interconnect Technology III.  pp.130-136,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3883
2.

Conference Proceedings
Conference Proceedings
2. Ultrathin integrated ion metal plasma titanium and metallorganic titanium nitride liners for sub-O.18-ｦﾌm tungsten-based metallization schemes for>500 MHz microprocessors
Khurana,N. ; Jackson,M. ; Zhang,Z. ; Mandrekar,T. ; Luo,H. ; Li,J. ; Pavate,V. ; Mosely,R. ; Narasimhan,M. ; Chang,M. ; Chen,F.
Pub. info.: Multilevel Interconnect Technology III.  pp.170-180,  1999.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3883