1.

Conference Proceedings
Conference Proceedings
1. Modeling of Lattice Site-Dependent Incomplete Ionization in α-SiC Devices
Ayalew, T. ; Grasser, T. ; Kosina, H. ; Selberherr, S.
Pub. info.: Silicon carbide and related materials 2004 : ECSCRM 2004 : proceedings of the 5th European Conference on Silicon Carbide and Related Materials, August 31 - September 4 2004, Bologna, Italy.  pp.845-848,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 483-485
2.

Conference Proceedings
Conference Proceedings
2. Numerical Simulation and Optimization for 900V 4H-SiC DiMOSFET Fabrication
Kim, S. C. ; Bahng, W. ; Kim, N. K. ; Kim, E. D. ; Ayalew, T. ; Grasser, T. ; Selberherr, S.
Pub. info.: Silicon carbide and related materials 2004 : ECSCRM 2004 : proceedings of the 5th European Conference on Silicon Carbide and Related Materials, August 31 - September 4 2004, Bologna, Italy.  pp.793-796,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 483-485
3.

Conference Proceedings
Conference Proceedings
3. A Case Study in Predictive Three-Dimensional Topography Simulation Based on a Level-Set Algorithm
Heitzinger, C. ; Sheikholeslami, A. ; Fugger, J. ; Haberlen, O. ; Leicht, M. ; Selberherr, S.
Pub. info.: Electrochemical processes in ULSI and MEMS : proceedings of the international symposium.  pp.132-144,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-17
4.

Conference Proceedings
Conference Proceedings
4. Numerical Analysis of SiC Merged PiN Schottky Diodes
Ayalew, T. ; Kim, S. C. ; Grasser, T. ; Selberherr, S.
Pub. info.: Silicon carbide and related materials 2004 : ECSCRM 2004 : proceedings of the 5th European Conference on Silicon Carbide and Related Materials, August 31 - September 4 2004, Bologna, Italy.  pp.949-952,  2005.  Uetikon-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 483-485
5.

Conference Proceedings
Conference Proceedings
5. Transient electro-thermal investigations of interconnect structures exposed to mechanical stress
Holzer, S. ; Hoilauer, C. ; Ceric, H. ; Wagner, S. ; Langer, E. ; Grasser, T. ; Selberherr, S.
Pub. info.: VLSI Circuits and Systems II.  pp.380-387,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5837