1.

Conference Proceedings
Conference Proceedings
1. Sequential Plasma Activated Process for Silicon Direct Bonding
M.R. Howlader ; H. Itoh ; T. Suga ; M. Kim
Pub. info.: Semiconductor wafer bonding 9 : science, technology, and applications.  pp.191-202,  2006.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 3(6)
2.

Technical Paper
Technical Paper
2. The Development of a Japanese 20N Thruster Valve for a Spacecraft Propulsion System
T. Nagata ; K. Kushiki ; K. Kajiwara ; Y. Sugimura ; M. Kobayashi ; H. Itoh
Pub. info.: AIAA meeting papers on disc.  2006.  Reston, Va.  American Institute of Aeronautics and Astronautics
Title of ser.: AIAA Paper : AIAA/ASME/SAE/ASEE Joint Propulsion Conference and Exhibit
Ser. no.: 2006