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28 results

Conference Proceedings

1. ESTIMATION OF THERMAL STRESSES AND STRESS CONCENTRATION IN CONFINED INTERCONNECTLINES OF RECTANGULAR CROSS SECTION

Korhonen, M. A. ; Borgesen, P. ; Li, Che-Yu

Pub. info.:	Materials reliability in microelectronics II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.. pp.39-44, 1992. Pittsburgh, PA. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	265

Conference Proceedings

2. X-RAY STRESS STUDIES OF PASSIVATED AND UNPASSIVATED NARROW ALUMINUM METALLIZATIONS

Paszkiet, C. A. ; Korhonen, M. A. ; Li, Che-Yu

Pub. info.:	Thin films : stresses and mechanical properties II : symposium held April 16-19, 1990, San Francisco, California, U.S.A.. pp.153-158, 1990. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	188

Conference Proceedings

3. MEASUREMENT OF STRESS RELAXATION IN THIN ALUMINUM METALLIZATIONS BY CONTINUOUS INDENTATION AND X-RAY TECHNIQUES

Korhonen, M. A. ; LaFontaine, W. R. ; Paszkiet, C. A. ; Black, R. D. ; Li, Che-Yu

Pub. info.:	Thin films : stresses and mechanical properties II : symposium held April 16-19, 1990, San Francisco, California, U.S.A.. pp.159-164, 1990. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	188

Conference Proceedings

4. STRESS INDUCED VOID NUCLEATION IN NARROW ALUMINUM ALLOY LINES

Borgesen, P. ; Korhonen, M. A. ; Basa, C. ; LaFontaine, W. R. ; Land, B. ; Li, C. -Y.

Pub. info.:	Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.. pp.143-148, 1991. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	225

Conference Proceedings

5. Electromigration Failure Distributions for Multi-Layer Interconnects as a Function of Line Width: Experiments and Simulation

Brown, D. D. ; Sanchez, J. E., Jr. ; Pham, V. ; Besser, P. R. ; Korhonen, M. A. ; Li, C.-Y.

Pub. info.:	Advanced metallization for future ULSI : symposium held April 8-11, 1996, San Francisco, California, U.S.A.. pp.107-, 1996. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	427

Conference Proceedings

6. MECHANICAL PROPERTIES OF PLATED COPPER

Korhonen, M. A. ; Brown, D. D. ; Li, C. -Y. ; Steinwall, J. E.

Pub. info.:	Electronic packaging materials science VII : symposium held November 29-December 3, 1993, Boston, Massachusetts, U.S.A.. pp.103-, 1994. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	323

Conference Proceedings

7. Flip-Chip Metallurgies for Lead-Free Solders

Korhonen, T. M. ; Hong, S. J. ; Korhonen, M. A. ; Li, C.-Y.

Pub. info.:	Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A.. pp.79-, 1998. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	515

Conference Proceedings

8. Under Bump Metallization Development for Eutectic Pb-Sn Solders

Hong, S. J. ; Korhonen, T. M. ; Korhonen, M. A. ; Li, C.-Y.

Pub. info.:	Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A.. pp.73-, 1998. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	515

Conference Proceedings

9. ANALYSIS OF THERMAL STRESS INDUCED VOID GROWTH DURING THERMAL CYCLING

Brown, D. D. ; Korhonen, M. A. ; Borgesen, P. ; Li, C. -Y.

Pub. info.:	Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.. pp.223-, 1993. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	309

10.

Conference Proceedings

10. MICROSTRUCTURE BASED MODELLING OF STRESS MIGRATION AND ELECTROMIGRATION INDUCED FAILURE DISTRIBUTIONS

Borgesen, P. ; Korhonen, M. A. ; Brown, D. D. ; Li. C. -Y.

Pub. info.:	Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.. pp.187-, 1993. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	309

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