1.

Conference Proceedings
Conference Proceedings
1. The Bonding Energy Control: An Original Way to Debondable Substrates
Moriceau, H. ; Rayssac, O. ; Aspar, B. ; Ghyselen, B.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.49-56,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. New SOI devices transferred onto fused silica by direct wafer bonding
Lagahe-Blanchard, C. ; Aspar, B. ; Paillet, P. ; Ferlet-Cavois, V. ; Fel, N. ; Pavageau, C. ; du Port de Poncharra, J. ; Moriceau, H.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.237-242,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03
3.

Conference Proceedings
Conference Proceedings
3. From SOI to SOIM technology: Application for specific semiconductor processes
Rayssac, O. ; Moriceau, H. ; Olivier, M. ; Stoimenos, I. ; Cartier, A.M. ; Aspar, B.
Pub. info.: Silicon-on-Insulator Technology and Devices X : proceedings of the tenth International Symposium.  pp.39-44,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-3
4.

Conference Proceedings
Conference Proceedings
4. Hydrogen and Helium Implantation to Achieve Layer Transfer
Lagahe-Blanchard, C. ; Sousbie, N. ; Sartori, S. ; Moriceau, H. ; Soubie, A. ; Aspar, B. ; Nguyen, P. ; Blondeau, B.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.346-367,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
5.

Conference Proceedings
Conference Proceedings
5. Overview on Some Recent Advances in Wafer Bonding Technologies
Moriceau, H. ; Fournel, F. ; Rayssac, O. ; Cartier, A.M. ; Morales, C. ; Pocas, S. ; Zussy, M. ; Jalaguier, E. ; Biasse, B. ; Bataillou, B. ; Papon, A.M. ; Lagahe, C. ; Aspar, B. ; Maleville, C. ; Leterte, F. ; Ghyselen, B. ; Barge, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.1-16,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27