1.

Conference Proceedings
Conference Proceedings
1. On the Influence of Titanium Alloy Composition and Layer Thickness on the Mechanical Properties of a Polyimide Substrate
Muralidharan, G. ; Narayanan, B. ; Wong, C. C. ; Manoharan, M.
Pub. info.: Electronic packaging materials science X : symposium held April 14-16, 1998, San Francisco, California, U.S.A..  pp.203-,  1998.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 515
2.

Technical Paper
Technical Paper
2. Fatigue properties of microelectronics solder joints
Nir, N. ; Dudderar, T. D. ; Wong, C. C. ; Storm, A. R.
Pub. info.: A.S.M.E. paper.  1990.  New York, NY.  The American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : WA/EEP
Ser. no.: 1990