1.
Conference Proceedings
Menzel, S. B. ; Albert, M. ; Reitz, D. ; Wendrock, H. ; Schmidt, H. ; Weihnacht, M. ; Wetzig, K. ; Bartha, J. W.
Pub. info.:
Materials, integration and packaging issues for high-frequency devices . pp.129-134, 2004. Warrendale, Pa.. Materials Research Society
Title of ser.:
Materials Research Society symposium proceedings
Ser. no.:
833
2.
Conference Proceedings
Kudela, S. ; Wendrock, H. ; Kudela, S. Jr. ; Ptacek, L. ; Menzel, S. ; Wetzig, K.
Pub. info.:
Materials structure & micromechanics of fracture IV : MSMF-4 : proceedings of the fourth International Conference on Materials Structure & Micromechanics of Fracture, Brno, Czech Republic, June 23-25, 2004 . pp.355-358, 2005. Uetikon-Zuerich, Switzerland. Trans Tech Publications
Title of ser.:
Materials science forum
Ser. no.:
482
3.
Conference Proceedings
Dauderstaedt, U. ; Duerr, P. ; Krellmann, M. ; Karlin, T. ; Berzinsh, U. ; Leonardsson, L. ; Wendrock, H.
Pub. info.:
MOEMS and Miniaturized Systems III . pp.277-284, 2003. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4983
4.
Conference Proceedings
Dauderstaedt, U. ; Duerr, P. ; Krellmann, M. ; Karlin, T. ; Berzinsh, U. ; Leonardsson, L. ; Wendrock, H.
Pub. info.:
MOEMS Display and Imaging Systems . pp.222-229, 2003. Bellingham, Wash.. SPIE-The International Society for Optical Engineering
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4985