1.

Conference Proceedings

Conference Proceedings
Menzel, S. B. ; Albert, M. ; Reitz, D. ; Wendrock, H. ; Schmidt, H. ; Weihnacht, M. ; Wetzig, K. ; Bartha, J. W.
Pub. info.: Materials, integration and packaging issues for high-frequency devices.  pp.129-134,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 833
2.

Conference Proceedings

Conference Proceedings
Kudela, S. ; Wendrock, H. ; Kudela, S. Jr. ; Ptacek, L. ; Menzel, S. ; Wetzig, K.
Pub. info.: Materials structure & micromechanics of fracture IV : MSMF-4 : proceedings of the fourth International Conference on Materials Structure & Micromechanics of Fracture, Brno, Czech Republic, June 23-25, 2004.  pp.355-358,  2005.  Uetikon-Zuerich, Switzerland.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 482
3.

Conference Proceedings

Conference Proceedings
Dauderstaedt, U. ; Duerr, P. ; Krellmann, M. ; Karlin, T. ; Berzinsh, U. ; Leonardsson, L. ; Wendrock, H.
Pub. info.: MOEMS and Miniaturized Systems III.  pp.277-284,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4983
4.

Conference Proceedings

Conference Proceedings
Dauderstaedt, U. ; Duerr, P. ; Krellmann, M. ; Karlin, T. ; Berzinsh, U. ; Leonardsson, L. ; Wendrock, H.
Pub. info.: MOEMS Display and Imaging Systems.  pp.222-229,  2003.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4985