1.

Conference Proceedings
Conference Proceedings
1. Wafer-Scale Surface Activated Bonding of Cu-Cu, Cu-Si, and Cu-SiO2 at Low Temperature
Kim, T.H. ; Howlader, M.M.R. ; Itoh, T. ; Suga, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.239-247,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Development of an UHV Surface Activated Bonding Machine for MEMS Packaging
Howlader, M.M.R. ; Okada, H. ; Itoh, T. ; Suga, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.309-320,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19