1.

Conference Proceedings
Conference Proceedings
1. Bonding Strength and Electrical Characteristics of Si/Si, Si/InP and Si/GaAs Interfaces Bonded by Surface Activated Bonding at Room Temperature: Influences of Sputtering Time and Energy
Howlader, M. ; Watanabe, T. ; Suga, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.41-47,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27
2.

Conference Proceedings
Conference Proceedings
2. Microsensors and actuator arrays based on Pb(Zr,Ti) O3 thin film for AFM data storage
Chu, J. ; Lu, J. ; Wu, Y. ; Huang, W. ; Maeda, R. ; Itoh, T. ; Suga, T.
Pub. info.: Micromachining and Microfabrication Process Technology and Devices.  pp.379-383,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4601