1.

Conference Proceedings
Conference Proceedings
1. Wafer-Scale Surface Activated Bonding of Cu-Cu, Cu-Si, and Cu-SiO2 at Low Temperature
Kim, T.H. ; Howlader, M.M.R. ; Itoh, T. ; Suga, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.239-247,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
2.

Conference Proceedings
Conference Proceedings
2. Development of an UHV Surface Activated Bonding Machine for MEMS Packaging
Howlader, M.M.R. ; Okada, H. ; Itoh, T. ; Suga, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.309-320,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
3.

Conference Proceedings
Conference Proceedings
3. Microsensors and actuator arrays based on Pb(Zr,Ti) O3 thin film for AFM data storage
Chu, J. ; Lu, J. ; Wu, Y. ; Huang, W. ; Maeda, R. ; Itoh, T. ; Suga, T.
Pub. info.: Micromachining and Microfabrication Process Technology and Devices.  pp.379-383,  2001.  Bellingham, Wash..  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4601
4.

Conference Proceedings
Conference Proceedings
4. Hybrid integration technologies for optical micro-systems (Invited Paper)
Higurashi, E. ; Itoh, T. ; Suga, T. ; Sawada, R.
Pub. info.: Optomechatronic Micro/Nano Components, Devices, and Systems.  pp.67-73,  2004.  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5604