1.

Conference Proceedings
Conference Proceedings
1. Design Considerations for SI and SIC Layer Transfer by H-Implantation
Tong, Q.-Y. ; Lee, T.-H. ; Huang, L.-J. ; Chao, Y.-L. ; Kim, W.J. ; Scholz, R. ; Tan, T.Y. ; Goesele, U.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.521-528,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Pressureless Silicon Direct Bonding in Ultrahigh Vacuum at Room Temperature
Ploessl, A. ; Scholz, R. ; Stenzel, H. ; Richtel, U. ; Schmidthals, C.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.417-424,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36