1.

Conference Proceedings

Conference Proceedings
Ploessl, A. ; Scholz, R. ; Schulze, H.-J. ; Hopfe, S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.224-231,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
2.

Conference Proceedings

Conference Proceedings
Dietsch, R. ; Holz, T. ; Mai, H. ; Hopfe, S. ; Scholz, R. ; Wehner, B. ; Wendrock, H.
Pub. info.: Structure and properties of multilayered thin films : symposium held April 17-19, 1995, San Francisco, California, U.S.A..  pp.345-,  1995.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 382