1.

Conference Proceedings
Conference Proceedings
1. Materials Issues in the Integration of F-doped TEOS for ULSI Applications
Boeck, B.A. ; Angyal, M.S. ; Filipiak, S.M. ; Rogers, B.
Pub. info.: Dielectric material integration for microelectronics.  pp.18-28,  1998.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-3
2.

Conference Proceedings
Conference Proceedings
2. Programmed Rate Chemical Vapor Deposition (PRCVD) Protocols
Yang, D. ; Jonnalagadda, R. ; Rogers, B. ; Hillman, J. ; Foster, R. ; Cale, T.
Pub. info.: Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability.  pp.221-231,  1998.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 98-6
3.

Conference Proceedings
Conference Proceedings
3. Integration of Multi-Level Copper Metallization into a High-Performance Sub-0.25 ｦﾌm Technology
Venkatraman, R. ; Jain, A. ; Farkas, J. ; Mendonca, J. ; Hamilton, G. ; Capasso, C. ; Denning, D. ; Simpson, C. ; Rogers, B. ; Frisa, L. ; Ong, T. P. ; Herrick, M. ; Kaushik, V. ; Gregory, R. ; Apen, E. ; Angyal, M. ; Filipiak, S. ; Crabtree, P. ; Sparks, T. ; Anderson, S.
Pub. info.: Advanced interconnects and contact materials and processes for future integrated circuits : symposium held April 13-16, 1998, San Francisco, California, U.S.A..  pp.41-,  1998.  Warrendale, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 514