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Conference Proceedings

1. Tribology of the ILD CMP Process During Pad Glazing and Conditioning - L. Chains and A. 2 Philipossian

Chains, L. ; Philipossian, A.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.2-12, 2002. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2002-1

Conference Proceedings

2. Analytical and Functional Characterization of Recycled Fumed Silica Slurries in ILD CMP

Levy, P. ; Rader, S. ; Lefevre, P. ; Ina, K. ; Shadman, F. ; Sugiysma, M. ; Philipossian, A.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.266-272, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-21

Conference Proceedings

3. The Spectral Fingerprints and the Sounds of CMP

Rosales-Yeomans, D. ; Doy, T. ; Philipossian, A.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.223-232, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-21

Conference Proceedings

4. Determining the Effects of Slurry Surfactant, Abrasive Size and Content on the Tribology and Kinetics of Copper CMP

Li, Z. ; Ina, K. ; Lefevrc, P. ; Philipossian, A.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.92-103, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-21

Conference Proceedings

5. Effect of Novel Pad Texture Designs on Tribology and Removal Rate Characteristics of ILD CMP

Doy, T. ; Kinoshita, M. ; Philipossian, A.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.165-172, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-21

Conference Proceedings

6. Heating and Convection in Copper Polishing

Borucki, L. ; Li, Z. ; Philipossian, A.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.61-67, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-21

Conference Proceedings

7. Analysis of Frictional Heating of Grooved and Flat CMP Polishing Pads

Borucki, L. ; Charns, L. ; Philipossian, A.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.173-181, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-21

Conference Proceedings

8. Comparison of Copper Disc and Copper Wafer Polishing Processes in of Terms their Kinetic, Tribological

Li, Z. ; Rader, S. ; Lefevre, P. ; Ina, K. ; Philipossian, A.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.35-43, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-21

Conference Proceedings

9. Real Time Measurement of Temperature In The Pad Wafer Region During CMP

Comely, J. ; Rogers, C. ; Manno, V. ; Philipossian, A.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.184-192, 2002. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2002-1

10.

Conference Proceedings

10. Mean Residence Time Analysis of CMP Processes

Philipossian, A. ; Mitchel, E.

Pub. info.:	Chemical Mechanical Planarization : proceedings of the International Symposium. pp.166-175, 2002. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2002-1

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