1.

Conference Proceedings
Conference Proceedings
1. Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology
Ghyselen, B. ; Bogumilowicz, Y. ; Aulnette, C. ; Abbadie, A. ; Osternaud, B. ; Besson, P. ; Daval, N. ; Andrieu, F. ; Cayrefourq, I. ; Moriceau, H. ; Ernst, T. ; Tiberj, A. ; Rayssac, O. ; Blondeau, B. ; Mazure, C. ; Lagahe-Blanchard, C. ; Pocas, S. ; Cartier, A.-M. ; Hartmann, J.-M. ; Leduc, P. ; Nardo, C.Di ; Lugand, J.-F. ; Fournel, F. ; Semeria, M.-N. ; Kernevez, N. ; Campidelli, Y. ; Kermarrec, O. ; Morand, Y. ; Rivoire, M. ; Bensahel, D. ; Paillard, V. ; Vincent, L. ; Claverie, A. ; Boucaud, P.
Pub. info.: High-mobility group-IV materials and devices : symposium held April 13-15, 2004, San Francisco, California, U.S.A..  pp.83-88,  2004.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 809
2.

Conference Proceedings
Conference Proceedings
2. The Bonding Energy Control: An Original Way to Debondable Substrates
Moriceau, H. ; Rayssac, O. ; Aspar, B. ; Ghyselen, B.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.49-56,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
3.

Conference Proceedings
Conference Proceedings
3. ALD alumina films as buried dielectric layers for SOI structures
de Beaumont, C. ; Moriceau, H. ; Rayssac, O. ; Bresson, N. ; Cristoloveanu, S. ; Charvet, A.M.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.231-236,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03
4.

Conference Proceedings
Conference Proceedings
4. New SOI devices transferred onto fused silica by direct wafer bonding
Lagahe-Blanchard, C. ; Aspar, B. ; Paillet, P. ; Ferlet-Cavois, V. ; Fel, N. ; Pavageau, C. ; du Port de Poncharra, J. ; Moriceau, H.
Pub. info.: Silicon-on-insulator technology and devices XII : proceedings of the international symposium.  pp.237-242,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-03
5.

Conference Proceedings
Conference Proceedings
5. From SOI to SOIM technology: Application for specific semiconductor processes
Rayssac, O. ; Moriceau, H. ; Olivier, M. ; Stoimenos, I. ; Cartier, A.M. ; Aspar, B.
Pub. info.: Silicon-on-Insulator Technology and Devices X : proceedings of the tenth International Symposium.  pp.39-44,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-3
6.

Conference Proceedings
Conference Proceedings
6. Silicon-on-insulator based quasi 3D photonic crystal structures
Zelsmann, M. ; Picard, E. ; Calvo, V. ; Charvolin, T. ; Hadji, E. ; Moriceau, H. ; Heitzmann, M. ; Nier, M.E. ; Seassal, C. ; Letartre, X.
Pub. info.: Photonic crystal materials and devices III : 24-27 January, 2005, San Jose, California, USA.  pp.23-31,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5733
7.

Conference Proceedings
Conference Proceedings
7. X-Ray Characterization of Bonding Interfaces
Rieutord, F. ; Moriceau, H. ; Bataillou, B. ; Morales, C. ; Eymery J.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.338-345,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
8.

Conference Proceedings
Conference Proceedings
8. Transfer of Two-Inch GaN Film by the Smart CutTM Technology
Tauzin, A. ; Akatsu, T. ; Rabarot, M. ; Dechamp, J. ; Zussy, M. ; Moriceau, H. ; Michaud, J.F. ; Charvet, A.M. ; Di Cioccio, L. ; Fournel, F. ; Garrione, J. ; Letertre, F. ; Faure, B. ; Kernevez, N.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.119-127,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
9.

Conference Proceedings
Conference Proceedings
9. Surface Plasma Activation Before Direct Wafer Bonding: A Short Review and Recent Results
Moriceau, H. ; Rieutord, F. ; Morales, C. ; Sartori, S. ; Charvet, A.M.(Invited)
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.34-49,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
10.

Conference Proceedings
Conference Proceedings
10. Hydrogen and Helium Implantation to Achieve Layer Transfer
Lagahe-Blanchard, C. ; Sousbie, N. ; Sartori, S. ; Moriceau, H. ; Soubie, A. ; Aspar, B. ; Nguyen, P. ; Blondeau, B.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.346-367,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19