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Conference Proceedings

1. Investigating the Effects of Diluting Solutions and Trace Metal Contamination on Aggregation Characteristics of Silica-Based ILD CMP Slurries

DeNardis, D. ; Choi, H. ; Kim, A. ; Moinpour, M. ; Oehler, A.

Pub. info.:	Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.. pp.159-166, 2005. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	867

Conference Proceedings

2. Feasibility of Detecting Barrier Layer to Low-K Transition in Copper CMP Using Raman Spectroscopy

Kondoju, S. ; Juncker, C. ; Lucas, P. ; Raghavan, S. ; Fischer, P. ; Moinpour, M. ; Oehler, A.

Pub. info.:	Chemical-mechanical planarization - integration technology and realiability : symposium held March 28-31, 2005, San Francisco, California, U.S.A.. pp.175-182, 2005. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	867

Conference Proceedings

3. Pad Degradation During CMP Process: Effect of Soak in Slurry and Water on Thermal and Mechanical Properties of the CMP Pads

Tregub, A. ; Ng, G. ; Moinpour, M.

Pub. info.:	Chemical-mechanical planarization : symposium held April 22-24, 2003, San Francisco, California, U.S.A.. pp.101-110, 2003. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	767

Conference Proceedings

4. Effect of Particle Interaction on Agglomeration of Silica-Based CMP Slurries

Sorooshian, A. ; Ashwani, R. ; Choi, H.K. ; Moinpour, M. ; Oehler, A. ; Tregub, A.

Pub. info.:	Advances in chemical-mechanical polishing : symposium held April 13-15, 2004, San Francisco, California, U.S.A.. pp.125-132, 2004. Warrendale, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	816