1.

Conference Proceedings

Conference Proceedings
A. Wei ; S. Duenkel ; R. Boschke ; M. Horstmann
Pub. info.: Advanced gate stack, source/drain and channel engineering for Si-based CMOS 3 : new materials, processes and equipment.  pp.15-22,  2007.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 6(1)
2.

Conference Proceedings

Conference Proceedings
O. Hahn ; M. Horstmann
Pub. info.: THERMEC 2006 : supplement to THERMEC 2006, 5th International conference on processing and manufacturing of advanced materials, July 4-8, 2006, Vancouver, Canada.  539-543  pp.1638-1643,  2007.  Stafa-Zuerich.  Trans Tech Publications
Title of ser.: Materials science forum
Ser. no.: 539-543(2)
3.

Conference Proceedings

Conference Proceedings
T. Feudel ; B. Bayha ; G. Burbach ; M. Gerhardt ; L. Herrmann ; M. Herden ; T. Mantei ; E. Ehrichs ; M. Greenlaw ; M. Horstmann
Pub. info.: Advanced gate stack, source/drain and channel engineering for Si-based CMOS 3 : new materials, processes and equipment.  pp.373-380,  2007.  Pennington, NJ.  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 6(1)
4.

Conference Proceedings

Conference Proceedings
M. Reiche ; C. Himcinschi ; U. Gösele ; S. Christiansen ; S. Mantl ; D. Buca ; Q. Zhao ; S. Feste ; R. Loo ; D. Nguyen ; W. Buchholtz ; A. Wei ; M. Horstmann ; D. Feijoo ; P. Storck
Pub. info.: Silicon-on-insulator technology and devices 13.  pp.339-344,  2007.  Pennington, N.J..  Electrochemical Society
Title of ser.: ECS transactions
Ser. no.: 6(4)