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11 results

Conference Proceedings

1. QUICK TESTS FOR ELECTROMIGRATION: USEFUL BUT NOT WITHOUT DANGER

Lloyd, J. R.

Pub. info.:	Advanced metallization and processing for semiconductor devices and circuits--II : symposium held April 27-May 1, 1992, San Francisco, California, U.S.A.. pp.735-744, 1992. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	260

Conference Proceedings

2. MECHANICAL STRESS AND ELECTROMIGRATION FAILURE

Lloyd, J. R.

Pub. info.:	Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.. pp.47-52, 1991. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	225

Conference Proceedings

3. ELECTROMIGRATION INDUCED RESISTANCE CHANGES IN PASSIVATED ALUMINUM THIN FILM CONDUCTORS

Mockl, U. E. ; Lloyd, J. R. ; Arzt, E.

Pub. info.:	Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.. pp.301-, 1993. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	309

Conference Proceedings

4. THE FINITE ELECTROMIGRATION BOUNDARY VALUE PROBLEM

Lloyd, J. R. ; Kitchin, J.

Pub. info.:	Materials reliability in microelectronics III : symposium held April 12-15, 1993, San Francisco, California, U.S.A.. pp.339-, 1993. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	309

Conference Proceedings

5. Electromigration-Induced Failure as a Function of Via Interface

Kisselgof, Larisa ; Lloyd, J. R.

Pub. info.:	Materials reliability in microelectronics VII : symposium held April 8-12, 1997, San Francisco, California, U.S.A.. pp.401-, 1997. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	473

Conference Proceedings

6. Stress and Electromigration

Lloyd, J. R.

Pub. info.:	Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.. pp.231-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	391

Conference Proceedings

7. Failure in Tungsten-Filled Via Structures

Clement, J. J. ; Lloyd, J. R. ; Thompson, C. V.

Pub. info.:	Materials reliability in microelectronics V : symposium held April 17-21, 1995, San Francisco, California, U.S.A.. pp.423-, 1995. Pittsburgh, Pa.. MRS - Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	391

Conference Proceedings

8. *ELECTROMIGRATION FAILURE AND MECHANICAL STRESS IN THIN FILM CONDUCTORS

Lloyd, J. R.

Pub. info.:	Thin films : stresses and mechanical properties III : symposium held December 2-5, 1991, Boston, Massachusetts, U.S.A.. pp.667-676, 1992. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	239

Conference Proceedings

9. INVESTIGATIONS ON A NEW FAILURE MODEL FOR ELECTROMIGRAT ION

Kitchin, J. ; Lloyd, J. R.

Pub. info.:	Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.. pp.27-34, 1991. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	225

10.

Conference Proceedings

10. ELECTROMIGRATION LIFETIME AND STEP COVERAGE IN Al/Cu/Si THIN FILM CONDUCTORS

Kisselgof, Larisa ; Elliott, L. J. ; Maziarz, J. J. ; Lloyd, J. R.

Pub. info.:	Materials reliability issues in microelectronics : symposium held April 30-May 3, 1991, Anaheim, California, U.S.A.. pp.107-112, 1991. Pittsburgh, Pa.. Materials Research Society
Title of ser.:	Materials Research Society symposium proceedings
Ser. no.:	225

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