1.

Conference Proceedings
Conference Proceedings
1. Development of Thermal Solution for High Power Flip Chip CPU Package
Kwon,H.K. ; Baek,J.H. ; Chun,J.W. ; Kim,M.H. ; Lee,T.K. ; Oh,S.Y. ; Ro,Y.H.
Pub. info.: 2000 International Conference on High-Density Interconnect and Systems Packaging, 25-28 April 2000, The Adam's Mark Hotel, Denver, Colorado, USA.  pp.313-319,  2000.  Reston, VA, Bellingham, Wash..  IMAPS — SPIE-The International Society for Optical
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4217
2.

Conference Proceedings
Conference Proceedings
2. New approach to measure border irregularity for melanocytic lesions
Lee,T.K. ; Atkins,M.S.
Pub. info.: Medical Imaging 2000: Image Processing.  Part1  pp.668-675,  2000.  Bellingham, Wash..  SPIE - The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 3979