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Conference Proceedings

1. Effectiveness of Residual Stress on Forming Copper Patterns of Printed Circuit Board

H.S. Lee ; H.C. Kwon

Pub. info.:	PRICM 7 : selected peer review papers from the seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia. pp.2716-2719, 2010. Aedermannsdorf, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	654-656

Conference Proceedings

2. Fabrication and Properties of a Combined Structural Cu Sheet for Interconnect Material

J.S. Shin ; H.K. Moon ; B.H. Kim ; H.S. Lee ; H.C. Kwon

Pub. info.:	PRICM 7 : selected peer review papers from the seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia. pp.2728-2731, 2010. Aedermannsdorf, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	654-656

Conference Proceedings

3. The Effects of Heat Treatment on the Bonding Strength of Surface-Activated Bonding (SAB)-Treated Copper-Nickel Fine Clad Metals

K.H. Kim ; S.C. Lim ; H.C. Kwon

Pub. info.:	PRICM 7 : selected peer review papers from the seventh Pacific Rim International Conference on Advanced Materials and Processing, August 2-6, 2010, Cairns, Australia. pp.1932-1935, 2010. Aedermannsdorf, Switzerland. Trans Tech Publications
Title of ser.:	Materials science forum
Ser. no.:	654-656