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Conference Proceedings

1. The Bonding Energy Control: An Original Way to Debondable Substrates

Moriceau, H. ; Rayssac, O. ; Aspar, B. ; Ghyselen, B.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.49-56, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19

Conference Proceedings

2. Advanced SOI Structures Based on Wafer Bonding: A Short Review

Ghyselen, B.

Pub. info.:	Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia. pp.96-109, 2003. Pennington, NJ. Electrochemical Society
Title of ser.:	Electrochemical Society Proceedings Series
Ser. no.:	2003-19