1.

Conference Proceedings
Conference Proceedings
1. Wafer Bonding for Patterning of Micromechanical Sensors
Wierner, M. ; Hiller, K. ; Gessner, T.
Pub. info.: Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications.  pp.138-146,  1997.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 97-36
2.

Conference Proceedings
Conference Proceedings
2. Application of High and Low Wafer Bonding Processes for Bulk Micromachined Components
Wiemer, M. ; Hiller, K. ; Hahn, R. ; Kaufmann, C. ; Gessner, T.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.368-380,  1999.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 99-35
3.

Conference Proceedings
Conference Proceedings
3. Trapping Behavior of Thin Siliconoxynitride Layers Prepared by Rapid Thermal Processing
Beyer, R. ; Burghardt, H. ; Reich, R. ; Thomas, E. ; Grambole, D. ; Herrmann, F. ; Scholz, T. ; Albrecht, J. ; Zahn, D. R. T. ; Gessner, T.
Pub. info.: Materials reliability in microelectronics VI : symposium held April 8-12, 1996, San Francisco, California, U.S.A..  pp.421-,  1996.  Pittsburgh, Pa..  MRS - Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 428
4.

Conference Proceedings
Conference Proceedings
4. Stress-Caused Deflections of Asymmetrical Coated Single-Crystal Silicon Elements
Kuechler, M. ; Griesbach, K. ; Bertz, A. ; Gessner, T. ; Faust, T. ; Dudek, R.
Pub. info.: Materials science of microelectromechanical systems (MEMS) devices : symposium held December 1-2, 1998, Boston, Massachusetts, U.S.A..  pp.33-38,  1999.  Warrendale, Pa..  Materials Research Society
Title of ser.: Materials Research Society symposium proceedings
Ser. no.: 546
5.

Conference Proceedings
Conference Proceedings
5. Bonding and Metallization for a High Precision Acceleration Sensor
Gessner, T. ; Wiemer, M. ; Hiller, K. ; Hafen, M.
Pub. info.: Proceedings of the Second International Symposium on Microstructures and Microfabricated Systems.  pp.297-308,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-27