1.

Conference Proceedings
Conference Proceedings
1. An Investigation of the Effects of Wafer Curvature Changes During Copper Damascene Processing
Carpio, R.A. ; Dorris, S.-T.L. ; Woodring, J. ; Owen, D.M. ; Abisia, D.
Pub. info.: Electrochemical processes in ULSI and MEMS : proceedings of the international symposium.  pp.235-250,  2005.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-17
2.

Conference Proceedings
Conference Proceedings
2. Patterning with 193 nm Resists
Bakshi, V. ; Smith, G. ; Alzaben, T. ; Beach, J. ; Spurlock, K. ; Berger., R. ; Dorris, S.-T.L. ; Holladay, D. ; Woehl, J.
Pub. info.: Thin film materials, processes, and reliability : proceedings of the international symposium.  pp.31-41,  2001.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-24