1.

Conference Proceedings
Conference Proceedings
1. Light Scattering Study of Roughness and Dishing on Post-CMP Wafers
Ding, P. ; Diaz, R. ; Hirleman, D.
Pub. info.: Chemical Mechanical Planarization : proceedings of the International Symposium.  pp.56-74,  2000.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2000-26
2.

Technical Paper
Technical Paper
2. Simulation of the Discharging Process Throughout a Porous Medium Initially Saturated with Fluid.
Carbajal, G. J. ; Gonzalez, J. E. ; Diaz, R.
Pub. info.: A.S.M.E. paper.  2003.  New York, NY.  American Society of Mechanical Engineers
Title of ser.: ASME Technical Paper : IMECE
Ser. no.: 2003
3.

Conference Proceedings
Conference Proceedings
3. A fully integrated low-noise amplifier in SiGe 0.35μm technology for 802.11 a WIFI applications
Pulido, R. S. ; Khemchandani, L. ; Goni-Ifurri, A. ; Diaz, R. ; Hernandez, A. ; del Pino, J.
Pub. info.: VLSI Circuits and Systems II.  pp.1064-1074,  2005.  Bellingham, Wash..  SPIE - The International Society of Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 5837
4.

Conference Proceedings
Conference Proceedings
4. SIM internal metrology beam launcher development
Zhao, F. ; Diaz, R. ; Kuan, G.M. ; Sigrist, N. ; Beregovski, Y. ; Ames, L.L. ; Dutta, K.
Pub. info.: Interferometry in Space.  Part One  pp.370-379,  2003.  Bellingham, WA.  SPIE-The International Society for Optical Engineering
Title of ser.: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.: 4852