1.

Conference Proceedings
Conference Proceedings
1. Evaluation of Strain in Bond and Etchback Silicon-on-Insulator
Egloff, R. ; Merchant, S. ; Greenberg, B. ; Baumgart, H.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.236-251,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7
2.

Conference Proceedings
Conference Proceedings
2. Analysis of Process-Induced Stresses in Lateral Trench Isolation Structures for High Voltage Devices in Bonded SOI Wafers
Baumgart, H. ; Letavic, T.J. ; Wolf, I.De. ; Tsou, L. ; Maes, H.E. ; Egloff, R.
Pub. info.: Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications.  pp.440-454,  1995.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 95-7