1.

Conference Proceedings
Conference Proceedings
1. Electrical Properties of Low-Temperature Bonded Unipolar Si/Si Junctions
Raeissi Nafchi, B. ; Amirfeiz, P. ; Engstrom O.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.355-366,  2005.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2005-02
2.

Conference Proceedings
Conference Proceedings
2. Wafer Bonding: a Flexible Way to Manufacture SOI Materials for High Performance Applications (Invited)
Bengtsson, S. ; Amirfeiz, P. ; Johansson, M.
Pub. info.: Microelectronics technology and devices : SBMICRO 2004 : proceedings of the nineteenth international symposium.  pp.241-252,  2004.  Pennington, N.J..  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2004-03
3.

Conference Proceedings
Conference Proceedings
3. Hydrophobic Low Temperature Wafer Bonding; Void Formation in the Oxide-Free Interface
Amirfeiz, P. ; Sanz-Velasco, A. ; Bengtsson, S.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.267-277,  2003.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2003-19
4.

Conference Proceedings
Conference Proceedings
4. Wafer Bonding using Oxygen Plasma Treatment in RIE and ICP RIE
Sanz-Velasco, A. ; Amirfeiz, P. ; Bengtsson, S. ; Colinge, C.
Pub. info.: Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia.  pp.31-40,  2001.  Pennington, NJ.  Electrochemical Society
Title of ser.: Electrochemical Society Proceedings Series
Ser. no.: 2001-27